Correlation between F2 Concentration in the PE-CVD Cleaning Exhaust Gas and Fluorine Radical Concentration in the Cleaning Plasma

摘要

Fluorocompounds such as C2F6,CF4,SF6,NF3 etc are used as conventional chamber cleaning gases of Plasma Enhanced Chemical Vapor Deposition (PE-CVD) equipment in a semiconductor manufacturing process.However,they are greenhouse gases that have very high global warming potentials (GWP) compared to CO2.