Electrode Response During Low and High Frequency Pulse Plating of Copper at a Rotating Disc Electrode

摘要

Electrodeposition by pulse plating has been shown to have advantages over DC plating by producing finer grain-sized,more compact and lower porosity deposits [1,2].In addition,it provides more parameters to enable better control of the deposition process [3].However,it is normally limited to a range of low pulse frequencies(<200Hz)in order to avoid the electrical double layer effect.The conventional view has been that the electrode response at high frequency will approach that of a DC signal so that the advantages of pulse plating are nullified and deposit properties similar to those obtained by DC plating are expected.Thus,electrodeposition carried out by pulse plating at high frequency and the electrical double layer effect occurring during electrodeposition have not received much attention from researchers.Recently,work in our laboratory has shown,however,that the application of frequencies as high as 200 kHz can lead to an improvement in deposit properties [4].