Mastering layer thickness distributions

摘要

A very practical and easy to use software package, called ELSY (Electrochemical Systems), will be presented. ELSY has been designed to find quick answers to problems related with layer thickness distributions. The software is applicable for a broad range of plating processes including co-deposition. The influence of the reactor geometry, screens, the shape of the workpieces to be plated, the applied voltage or current, the ohmic voltage drop in electrodes on the current density and consequently the layer thickness can easily be calculated. First the mathematical model is briefly explained. Then the following applications with industrial relevance are presented: Cu-plating on wafers and PCB's and electrode growth. Finally the potentialities of ELSY{sup}+, a software considering also influences of fluid flow and concentration gradients, will be demonstrated.