Angular Multiplexing for optical Board to Board Interconnections

机译：光电板的角度复用到板互连

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摘要

Optical signal transmission benefits, among other features, from its huge potential of multiplexing. Besides wavelength, time or space division multiplexing (WDM, TDM, SDM) a further multiplexing technique is proposed here: Angular division multiplexing (ADM).

机译：除其他特征中，光信号传输从其多路复用的巨大电位效益。除了波长，时间或空间复用（WDM，TDM，SDM）之外，这里提出了一种进一步的复用技术：角分分流（ADM）。

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《Conference on Optics in Computing》|1999年|Postconference ed|共3页
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R. Klug; U. W. Krackhardt; K.-H. Brenner;
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中图分类 TP393-532;
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专利

1. Board-to-board free-space optical interconnections passing through boards for a bookshelf-assembled terabit-per-second-class ATM switch [J] . Katsuhiko Hirabayashi, Tsuyoshi Yamamoto, Shinji Matsuo Applied optics . 1998,第13a16期

机译：板对板自由空间光互连穿过板，用于书架式组装的每秒兆兆级ATM交换机
2. Board-to-board free-space optical interconnections passing through boards for a bookshelf-assembled terabit-per-second-class ATM switch [J] . Hirabayashi K., Matsuo S., Hino S., Applied optics . 1998,第14期

机译：板对板自由空间光互连穿过板，用于书架式组装的每秒兆兆级ATM交换机
3. Optical beam direction compensating system for board-to-board free space optical interconnection in high-capacity ATM switch [J] . Hirabayashi K., Yamamoto T. Journal of Lightwave Technology . 1997,第5期

机译：大容量ATM交换机中板对板自由空间光互连的光束方向补偿系统
4. Angular Multiplexing for optical Board to Board Interconnections [C] . R. Klug, U. W. Krackhardt, K.-H. Brenner Conference on Optics in Computing . 1999

机译：光电板的角度复用到板互连
5. Thin-film VCSEL and optical interconnection layer fabrications for fully embedded board level optical interconnects. [D] . Choi, Chul Chae. 2003

机译：用于完全嵌入式板级光互连的薄膜VCSEL和光互连层制造。
6. Angular-multiplexed multichannel optical vortex arrays generators based on geometric metasurface [O] . Jinjin Jin, Xiong Li, Mingbo Pu, 2021

机译：基于几何元曲面的角度复用多通道光学涡旋阵列发电机
7. Angle division multiplexing in multimode fibers for optical board-to-board interconnection [O] . K.-H. Brenner, R. Klug, Ulrich W. Krackhardt 1999

机译：多模纤维中的角分复用，用于光学板到板互连

Angular Multiplexing for optical Board to Board Interconnections

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