Integration of a planar inverted F antenna on a cavity-down ceramic ball grid array package

摘要

This paper presents the integration of an antenna is a chip package for the tingle-chip solutions at wireless transceivers in CMOS. The antenna that takes the basic form of a planar inverted F is integrated an a thin 15 mm × 15 mm cavity-down ceramic hall grid array package. The planar patch tine it 10.8 mm × 9.9 mm. The prototype antenna has achieved the impedance bandwidth of 4.12% and the gain of -9 dBi at 2.43 GHz.