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Interface stress and an apparent negative poisson's ratio in Ag/Ni multilayers

机译:AG / NI多层的界面压力和表观负泊松比率

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By use of dc-magnetron sputtering, (111) textured Ag/Ni multilayered thin films were deposited with nominal bilayer repeat lengths ranging from 2 nm to 250 nm. Bulk and interface stresses were obtained from X-ray diffraction and measurements of substrate curvatures. Both in-plane and out-of-plane expansions were observed in the Ni layers, and a compressive interface stress of -2.24+-0.21 J/m~2 was found. This is in agreement with a previously published result of the interface stress in Ag/Ni thin films which had, as opposed to the present multilayers, a high level of total stress.
机译:通过使用DC-磁控溅射,(111)纹理化AG / Ni多层薄膜沉积,标称双层重复长度范围为2nm至250nm。从X射线衍射和基板曲率测量获得体积和界面应力。在Ni层中观察到平面内和面外扩展,并发现-2.24 + -0.21 j / m〜2的压缩界面应力。这与先前公布的AG / Ni薄膜中的界面应力的结果一致,与本发明的多层相反,具有高水平的总压力。

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