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Modeling the Electroconsolidation Process

机译:建模电胶覆盖过程

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摘要

Electroconsolidation is a process for densifying complex-shaped parts using electrically conductive particulate solids as a pressure-transmitting medium. The part is immersed within a bed of the particulate medium contained in a die chamber. Heating to sintering temperature is achieved by resistive heating of the medium while applying compaction pressure. The process is capable of ultra-high temperatures and short cycle times, and it offers the potential for low processing costs. Control of the process as well as selection of process conditions require knowledge of the temperatures within the die. Temperature gradients will exist because of the high heating rate and because of variations of density and electrical resistivity of the medium due to the presence of the part. Direct measurement of temperature with thermocouples or other conventional means is impractical because of the high temperatures, high currents, and high pressures. Therefore, a computer model was developed to predict the temperature as a function of time and applied voltage for any location in the die. The computer model contains three parts: a geometrical model to approximate the density and resistivity variations in the medium, a finite-element model to calculate the rate of resistive heating within each element, and a finite-difference model to calculate the temperature distribution based upon solution of the heat-transfer equations. Predicted temperatures have been shown to be in excellent agreement with measurements.
机译:电沉积化是使用作为压力传递介质的导电颗粒固体致密化复合物部件的方法。将该部分浸入模具室中包含的颗粒介质的床内。通过在施加压实压力的同时通过电阻加热来实现加热到烧结温度。该过程能够进行超高气温和短循环时间,并提供低处理成本的潜力。控制过程以及过程条件的选择需要了解模具内的温度。由于高加热速率并且由于介质的存在,因此温度梯度将存在由于介质的密度和电阻率而导致的部分。由于高温,高电流和高压力,通过热电偶或其他常规方法的温度的直接测量温度是不切实际的。因此,开发了一种计算机模型以将温度预测为时间的时间和施加电压的函数,用于模具中的任何位置。计算机型号包含三个部分:几何模型,以近似介质的密度和电阻率变化,有限元模型计算每个元件内的电阻加热速率,以及基于的温度分布计算温度分布的有限差异模型传热方程的溶液。预测的温度已被证明与测量结果很好。

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