Ompac Package C5 Reliability-Parametric Study

摘要

Over Molded Pad Array Carrier (OMPAC) also called as Ball Grid Array (BGA) has been used in products, such as hand held two way radio wihtin Motorola. Now it has gained interest outside Motorola in companies like Compaq for portable computers and AT&T for the telephone systems. The reduced size, thickness and increased I/O density at the board level are the attractive features of the OMPAC package over other competing package types.