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Modulus Reduction Mechanism of Trimethylsiloxy Silicates in a Polyorganosiloxane

机译:三甲基硅氧烷在聚有机硅氧烷中的模量还原机理

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Trimethylsiloxy silicates can be added to network forming linear polyorganosiloxane-based formulations to reduce the elastic modulus of the resulting cross-linked network without the loss of ultimate strength or excessive bleeding that typically occurs when either linear oligomers or polymer additives are used. The linear viscoelastic properties of uncured blends of a polyorganosiloxane with different loadings of silicates were characterized using time-temperature superposition to investigate the physical factors responsible for the modulus drop. The reduction in the plateau modulus of the polymer was found to be consistent with the power-law relation observed for nonentanglement-forming diluents, and was accompanied by a decrease in the frequency range of the plateau regime with increasing silicate content. Swelling and extraction studies on the corresponding cross-linked networks were conducted to help postulate the primary physical factors responsible for the modulus reduction. The modulus reduction enables lowdurometer, high-elongation elastomeric materials useful in silicone rubbers, high-movement joint sealants and pressure-sensitive adhesives.
机译:三甲基硅氧烷硅酸盐可以加入到网络形成线性聚有机硅氧烷的制剂中,以减少所得交联网络的弹性模量,而不会损失最终强度或过量出血,当使用线性低聚物或聚合物添加剂时通常发生。使用时间温度叠加表征具有不同硅酸盐的聚有机硅氧烷的未固化共混物的线性粘弹性特征,以研究负责模量降的物理因素。发现聚合物的平台模量的降低与非间间形成稀释剂的幂律关系一致,并且伴随着高原地区的频率范围的降低,随着硅酸盐含量增加。对相应的交联网络进行肿胀和提取研究,以帮助假设负责减少模量的主要物理因素。模量减少使低抗动仪,高延长弹性体材料可用于硅橡胶,高运动接头密封剂和压敏粘合剂。

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