Due to localized high heat fluxes, hot-spots are created in silicon chips. Cooling of the hot-spots is one of the major thermal challenges in today's integrated circuit (IC) industry. Many researches have been conducted to find ways to cool hot-spots using different techniques as uniform heating is highly desired. This paper focuses on cooling of hot-spot using conventional thermoelectric cooler (Melcor_CP1.0-31-05L.1) and a micro heat pipe. A chip package with conventional integrated heat spreader and heat sink was designed. Hot-spot was created at the center of the silicon die with background heat at rest of the area. The heat flux on the hot-spot was much greater than rest of the area. Forced convection was used to cool IC package, temperature was observed at active side of the silicon die. After that a copper conductor was used to take away heat directly from the hot-spot of the silicon die to the other end of the conductor which was cooled using the thermoelectric cooler. Finally the conductor was replaced by a heat pipe and a comparison between three cases was done to study the cooling performance using the commercial software, ANSYS Icepak. The effect of trench on silicon die was also studied.
展开▼
