Ion implantation of Cu in high purity silica has been used to produce nanometer size metallic copper clusters. The size and size distribution of these colloids have been characterized by quantitative images analysis emphasizing transmission electron microscopy. Electron diffraction patterns indicate they are crystalline FCC copper embedded in the amorphous silica host. The ion implantation dose and substrate temperatures alter the size distribution of the colloidal copper. The optical transmission of implanted silica containing varying sizes and size distributions of Cu clusters has been determined and is related to the size distribution.
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