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Novel processing techniques for optoelectronic devices and their integration (Invited Paper)

机译:光电器件的新型加工技术及其集成(邀请纸)

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Novel processing techniques currently being developed for the fabrication of optoelectronic devices are described: including fabrication of low threshold lasers using in-situ monitored reactive ion etching, the use of impurity-induced-disordering to form high-performance lasers with self-aligned Si/Zn diffused junctions, and the fabrication of in-plane surface-emitting lasers with 45 inch etched facets. Application to the monolithic integration of optoelectronic devices is discussed.
机译:描述了目前用于制造光电器件的新型处理技术:包括使用原位监测的反应离子蚀刻制造低阈值激光器,使用杂质诱导的排序以形成具有自对准Si /的高性能激光器。 Zn扩散结,以及用45英寸蚀刻刻面的面内表面发射激光器的制造。讨论了对光电器件的单片集成的应用。

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