In-line automated inspection for semiconductor assembly

摘要

Several in-line automated inspection techniques for semiconductor assembly are discussed. First, the characteristics of in-line automated inspection are described. Then, a machine vision system that is being developed for TAB tape inspection is presented. Machine vision techniques for two-dimensional and three-dimensional flaw inspection are proposed. A laser/infrared technique, scanning laser acoustic microscopy (SLAM), and a 3D X-ray technique that are capable of nondestructive inspection are evaluated.