Effect of Processing Conditions and Interfacial Geometry on Reaction Metallurgical Joining of Copper

摘要

Reaction metallurgical joining (RMJ) was recently developed as a new method for copper-to-copper joining. In this study, a cold metal transfer (CMT) process was investigated to pre-place a low-melting-temperature reaction material between the copper parts to be joined prior to the RMJ process. The joint area is heated via an applied electrical current so that the reaction material dissolves the base metal surface to form a reaction product with a lower solidus temperature than copper. The applied load causes this reaction product, a liquid and/or liquid-solid mixture, to be displaced from the joint, during which time it carries away surface oxides and contaminants. The metallurgically clean opposing surfaces are brought into contact to form a continuous metallurgical bond. The combination of CMT and RMJ methods will potentially provide a robust copper joining process.