Scanner Baseliner Monitoring and Control in High Volume Manufacturing

摘要

We analyze performance of different customized models on baseliner overlay data and demonstrate the reduction in overlay residuals by ～10%. Smart Sampling sets were assessed and compared with the full wafer measurements. We found that performance of the grid can still be maintained by going to one-third of total sampling points, while reducing metrology time by 60%. We also demonstrate the feasibility of achieving time to time matching using scanner fleet manager and thus identify the tool drifts even when the tool monitoring controls are within spec limits. We also explore the scanner feedback constant variation with illumination sources.