Modelling the electromechanical impedance method for the prediction of the biomechanical behavior of dental implant stability

摘要

We propose the electromechanical impedance (EMI) technique to assess the stability of dental implants. The technique consists of bonding a piezoelectric transducer to the element to be monitored. Conventionally, electromechanical admittance is used to diagnose structural damage. In this study, we created a 3D finite element model to mimic a transducer bonded to the abutment of a dental implant placed in a host bone site. We simulated the healing after surgery by changing the Young's modulus of the bone-implant interface. The results show that as the Young's modulus of the interface increases, the electromechanical characteristic of the transducer changes.