A Study on the Effect of Process Parameters on Thin NAND Flash Wafer by Multi - Beam Matrix Laser Cutting

摘要

This study is designed to investigate the influence of multi-beam matrix laser cutting process on NAND Flash package quality, and find out the important process parameters of multi-beam matrix laser process are defocus amount, laser power, cutting speed and material thickness. Then use the finite element analysis software ANSYS to obtain the minimum temperature influence, stress and strain, and use Taquchi method and variance analysis (ANOVA) to find the optimal temperature combination, the optimal combination of stress and strain and its contribution degree. Finally, the reliability is tested by verification experiments, and the error is found to be within 3.638%. It is confirmed that the optimized parameter combination has high repetitiveness. It is hoped that this study can contribute to the multi-beam matrix laser cutting process.