We introduced in this paper a simulation tool designed to predict the most common defects related to the in-mold decoration process. Ink-wash is the most obvious aesthetic problem caused by high temperature or high shear from the incoming melt. Warpage is another dimensional uncertainty defect due to the poor heat conduction of the film. Overcoming these problems often requires mold fixing including critical gate location change. Mold filling simulation could help identify these potential problems in the early mold design stage. However, conventional simulation techniques require tedious work of thin layer mesh making of the decoration film. It is therefore essential to develop a quick pre- process tool without losing simulation accuracy.
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