HIGH FLOW SF ULTEM~(TM) RESIN MATERIALS FOR HIGH HEAT THIN WALL CONSUMER ELECTRONICS APPLICATION

摘要

Trends in consumer electronics towards design freedom, miniaturization, high modulus, weight reduction and lower system costs have resulted in an increased usage of high flow high heat thermoplastics. SABIC recently introduced its Ultem~(TM) SF resin portfolio, a family of high flow glass filled polyetherimide polymers. The resin has outstanding mechanical properties and dimensional stability at elevated temperature and increased flow ability compared with that of the traditional GF filled Ultem~(TM) resin grades. This paper will compare properties of Ultem~(TM) SF resins with the GF PES materials. Some potential application of Ultem~(TM) SF resin grades will also be discussed.