MATHEMATIC MODEL OF HEAT TRANSPORT IN MATERIALS DURING CUTTING PROCESS

摘要

Printed circuit boards (PCBs) that represent a significant part of electronic waste are potential sources of material and energy. In the paper we focused on study of a cutting as an alternative method of conductive ways separating from plastic board as one of stages of the printed circuit board recycling procedure. High velocity of cutting belt is connected with enormous heat production. Due to the generation of high temperatures may lead to caking of separated components of metal and plastic materials. For this reason we formulated mathematic model of the cutting process and on the base we can determine of temperature fields in PCB materials during cutting. Of courses of them we can calculate the heat intensity and consequently the critical velocity of cutting belt without damage of PCB materials.