NOVEL DESIGN FOR MICROSTRIP TO STRIPLINE TRANSITIONS FOR MILLIMETER-WAVE APPLICATION IN LTCC

摘要

This paper presents two transitions between microstrip and stripline in Low Temperature Co-fired Ceramic technology, including a vertical transition and a coplanar transition for millimeter-wave application. These interconnects are simulated and optimized by three-dimensional electromagnetic filed simulator. Simulation results show that the return loss of microstrip to stripline vertical transition is less than -22dB, and insertion losses is better than 0.5dB up to 35GHz, and better than ldB up to 40GHz. Similarly, the return-loss of the coplanar transition is less than -32dB and insertion loss is better than 0.5dB. LTCC test structures were fabricated and the performance of all transitions successfully validated by scattering parameter measurements up to 40GHz.