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Performance of 20×20×5 mm~3 Pixelated Cadmium Zinc Telluride Semiconductor Detectors from Various Anode Fabrication Techniques

机译:来自各种阳极制造技术的20×20×5mm〜3像素化镉锌碲化物半导体探测器的性能

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The anode fabrication process for pixelated Cadmium Zinc Telluride detectors is constantly evolving. In September of 2012, Redlen Technologies began manufacturing 50 20 × 20 × 5 mm~3 CdZnTe planar-cathode common-grid 11 × 11 pixelated detectors to determine which fabrication technique minimizes gain deficit. The anode fabrications are divided into 5 groups: standard fabrication with gold contacts on printed circuit board substrate, sputtered platinum contacts, ceramic substrate, and 2 proprietary fabrication techniques dubbed A and B. The performance of these detectors is studied and ranked by comparing gain deficit and standard parameters such as bulk and grid resistivity, energy and imaging resolution, and grid steering in order to recommend adjustments to the standard manufacturing technique and gauge the suitability of these detectors for a multi-detector array system.
机译:像素化镉锌碲化镉探测器的阳极制造过程不断发展。 2012年9月,Redlen Technologies开始制造50 20×20×5 mm〜3 Cdznte Planar-Condode Compand-Grid 11×11像素化探测器,以确定哪种制造技术可最大限度地减少增益缺陷。阳极制造分为5组:用印刷电路板基板上的金触点,溅射铂触点,陶瓷基板和2个专有制造技术被称为A和B的标准制造。通过比较增益缺陷来研究这些探测器的性能和排序和标准参数,如批量和电网电阻率,能量和成像分辨率和电网转向,以便建议调整标准制造技术,并衡量这些探测器对多探测器阵列系统的适用性。

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