Performance analysis of multiwalled carbon nanotube bundles

摘要

In this work, we have presented a comprehensive analysis of the performances of Copper wire and MWCNT (Multi-walled Carbon Nano Tube) bundles across deep submicron technology nodes like 45nm, 32nm, 22nm and 16nm. The analysis has been done for local, intermediate and global level interconnects. The analytical closed form delay expressions for both the Copper wire and MWCNT bundles have been found out. It is observed that MWCNT bundles show better performance over Copper wire at all level of interconnects and technology nodes. In 16 nm technology node, the performance advantage numbers of MWCNT bundle over Copper wire are 50%, 90% and 85% for 20-μm long local interconnect, 200-μm long intermediate interconnect and 10000-μm long global interconnect respectively. It is also observed that performance numbers improve with scaling for all level of interconnects and the ratio of delay of MWCNT bundles and Copper wire for various level of interconnects agree well with the existing work.