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Analysis of the Area-Delay Performance of Hybrid Nanoelectronic Memory Cores Used in Field Programmable Gate Arrays

机译:现场可编程门阵列中混合纳米电子存储芯的区域延迟性能分析

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In this paper, an area-delay metric (AT) of hybrid memristive/CMOS memory architectures is discussed. The proposed memory circuit can be used as a lookup table in field programmable gate arrays (FPGAs) and is modeled by a passive nanoelectronic crossbar comprising resistive switches (RS) as memory elements. In particular, resistive switches which are based on the electrochemical metallization effect (ECM) are assumed. At the periphery, CMOS circuits are included with provide appropriate voltage levels for robust read and write operations. The optimization of the CMOS periphery was done for a 40-nm CMOS technology, and especially in regard to the physical properties of ECM cells which allows for the derivation of a realistic AT metric for the memory core circuit. For different architectural choices, the evaluation of the AT metric shows, that the area overhead which is caused by the peripheral CMOS circuits significantly determines the total circuit area. Under almost all conditions the required silicon area per bit is far beyond 4F2 (F: lithographic resolution), but for particular conditions the effective area per bit is smaller than the area per bit which is required for a corresponding SRAM core circuit.
机译:在本文中,讨论了混合映射/ CMOS存储器架构的区域延迟度量(AT)。所提出的存储器电路可以用作现场可编程门阵列(FPGA)的查找表,并且由包括电阻开关(RS)的被动纳米电子横杆为模型作为存储器元件。特别地,假设基于电化学金属化效果(ECM)的电阻开关。在外围,CMOS电路包括提供适当的电压电平,用于鲁棒读写操作。 CMOS周边的优化是针对40nm CMOS技术完成的,特别是关于ECM小区的物理性质,其允许在存储器核路电路的度量处实现逼真的逼真。对于不同的架构选择,在公制的评估中,是由外围CMOS电路引起的区域开销显着决定了总电路区域。在几乎所有条件下,每位所需的硅面积远远超过4F2(F:光刻分辨率),但对于特定条件,每个位的有效面积小于每个对应的SRAM核心电路所需的面积。

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