Evaluation of thermal mapping analysis technique for failure mechanism

摘要

Fault isolation is a process for failure analysis laboratory to identify where the defect is and correlate it to the physical location. There are many different challenges to consider in localization techniques since there are multiples electrical faults with render multiple failure mechanisms. Basically, depending on the location of the physical defect, the faults mechanism will vary, as well as, the electrical consequences. There are different techniques to identify failure localizations. Selection of the localization technique depends on the fault electrical signatures - given that a defect can lead to multiple electrical consequences, depending on how it is stimulated (in this case recovery after mold compound removal).