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Processing and Properties of Microporous Insulation Materials with Layered Structure

机译:分层结构的微孔绝缘材料的处理与性能

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摘要

A novel processing route for developing microporous insulation materials with layered structure has been developed. In this study, microporous insulation materials with layered structure were fabricated by controlling template morphology and additive compositions. The microstructure, porosity, mechanical strength, and thermal conductivity of microporous insulation materials were characterized as functions of the forming pressure, ceramic composition, template content, and sintering time. By controlling the processing parameters, template type, template content, and additive composition, it was possible to adjust the porosity from 30% to 70%. Typically, compressive strength and thermal conductivity of microporous insulation materials with -55% porosity were ~14 MPa and 0.41 W/nrK, respectively.
机译:开发了一种用于开发具有层状结构的微孔绝缘材料的新型加工途径。在该研究中,通过控制模板形态和添加剂组合物来制造具有层状结构的微孔绝缘材料。微孔绝缘材料的微观结构,孔隙,机械强度和导热性表征为成形压力,陶瓷组成,模板含量和烧结时间的功能。通过控制处理参数,模板类型,模板含量和添加剂组合物,可以将孔隙率调节为30%至70%。通常,具有-55%孔隙率的微孔绝缘材料的抗压强度和导热率分别为约14MPa和0.41W / NRK。

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