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Processing and Properties of Microporous Insulation Materials with Layered Structure

机译:层状微孔绝缘材料的加工与性能

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摘要

A novel processing route for developing microporous insulation materials with layered structure has been developed. In this study, microporous insulation materials with layered structure were fabricated by controlling template morphology and additive compositions. The microstructure, porosity, mechanical strength, and thermal conductivity of microporous insulation materials were characterized as functions of the forming pressure, ceramic composition, template content, and sintering time. By controlling the processing parameters, template type, template content, and additive composition, it was possible to adjust the porosity from 30% to 70%. Typically, compressive strength and thermal conductivity of microporous insulation materials with -55% porosity were ~14 MPa and 0.41 WrK, respectively.
机译:已经开发出一种用于开发具有层状结构的微孔绝缘材料的新工艺路线。在这项研究中,通过控制模板的形态和​​添加剂的组成来制造具有分层结构的微孔绝缘材料。表征了微孔绝热材料的微观结构,孔隙率,机械强度和导热系数,它们是成型压力,陶瓷成分,模板含量和烧结时间的函数。通过控制加工参数,模板类型,模板含量和添加剂组成,可以将孔隙率从30%调整为70%。通常,孔隙率为-55%的微孔绝缘材料的抗压强度和导热系数分别为〜14 MPa和0.41 W / nrK。

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