首页> 外文会议>Conference of Abrasive Technology in China >Force and Energy in Grinding Zirconia Ceramics by Brazed Monolayered Diamond Wheels
【24h】

Force and Energy in Grinding Zirconia Ceramics by Brazed Monolayered Diamond Wheels

机译:用钎焊的单层金刚石齿轮磨削氧化锆陶瓷的力量和能量

获取原文

摘要

An investigation was undertaken to explore the grinding energy and removal mechanisms in grinding zirconia by using brazed diamond wheels. The grinding forces were measured and the morphological features of ground workpiece surfaces were examined. The results indicate that material removal mechanisms are dominated by the combined removal modes of brittle and ductile. The prevailing removal mechanism for the ground surface of zirconia changes from brittle to ductile when the maximum chip thickness change from large to small.
机译:采用钎焊金刚石轮探测研磨能量和去除机制,通过使用钎焊的金刚石轮探测氧化锆的研磨能量和去除机制。测量研磨力,检查研磨工件表面的形态特征。结果表明,材料去除机制由脆性和延性的组合去除模式主导。当最大芯片厚度从大到小的最大芯片厚度变化时,氧化锆接地表面的普遍除去机制从脆性变为延展性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号