首页> 外文会议>International Symposium on Cleaning and Surface Conditioning Technology in Semiconductor Device Manufacturing >IN-SITU VAPOR PHASE PROCESSES IN AN INTEGRATED CLUSTER SYSTEM FOR PRE-GATE OXIDE SILICON SURFACE CLEANING
【24h】

IN-SITU VAPOR PHASE PROCESSES IN AN INTEGRATED CLUSTER SYSTEM FOR PRE-GATE OXIDE SILICON SURFACE CLEANING

机译:用于预栅极氧化物硅表面清洁的集成簇系统中的原位蒸汽相工艺

获取原文

摘要

Vapor phase pre-gate oxide surface preparation was studied in a high vacuum cluster tool. Sacrificial or native oxide was etched with vapor Hydrofluoride and trace metallic and Hydrocarbon contamination were removed with a UV/Cl{sub}2 process. Surface residuals were analyzed with X-ray Photoluminescence Spectroscopy (XPS) and the surface morphology was investigated with Atomic Force Microscopy (AFM). Metal-Oxide-Semiconductor devices were fabricated on differently cleaned Si surfaces. The electrical properties of the SiO{sub}2/Si interface and the SiO{sub}2 integrity were characterized with Capacitance-Voltage (C-V) and Time-Dependent-Dielectric-Breakdown (TDDB) techniques.
机译:在高真空簇工具中研究了气相前氧化物表面制剂。用气相氢氟化物蚀刻牺牲或天然氧化物,用UV / Cl {} 2加工除去痕量金属和烃污染。用X射线光致发光光谱(XPS)分析表面残留物,用原子力显微镜(AFM)研究了表面形态。在不同清洁的Si表面上制造金属氧化物半导体器件。 SIO {SUB} 2 / SI接口和SIO {SUB} 2完整性的电性能具有电容 - 电压(C-V)和时间依赖性介电 - 击穿(TDDB)技术。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号