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Surface Complexation of Metals: A Predictive Model Based on Metal Coordination Chemistry

机译:金属表面络合:基于金属协调化学的预测模型

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Various approaches to understanding and predicting adsorption metals onto oxidized silicon wafers have been put forward, with varying degrees of success, including ones based on electrochemical thermodynamics (ie Pourbaix diagrams) [1], solubility/precipitation [2], adsorption/desorption kinetics [3], and equilibrium thermodynamics [4]. This paper will explain the adsorption of metals at the silica surface in terms of the coordination chemistry of metal ions. A qualitative approach capable of predicting the robustness of chemical clean ups towards specific metals will be described. The conclusions based on this approach will be compared to original data as well as to data found in the literature.
机译:已经提出了对氧化硅晶片的各种方法,以氧化硅晶片提出,具有不同程度的成功,包括基于电化学热力学(IE POPBAIX图)[1],溶解度/沉淀[2],吸附/解吸动力学[ 3]和平衡热力学[4]。本文将在金属离子配位化学方面解释二氧化硅表面在二氧化硅表面的吸附。将描述能够预测化学清洁朝向特定金属的稳健性的定性方法。基于这种方法的结论将与原始数据以及文献中的数据进行比较。

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