Low-Cost Far-Infrared FPA based on High-Volume Pressure Sensor Process

摘要

In order to achieve substantial cost reduction for far-infrared focal plane arrays (FPA), consequent adoption of existing high-volume MEMS processes is required. For that reason we used a high-volume pressure sensor process for fabrication of thermodiode FPA. While 1~(st) Gen FPA successfully proved the suitability of the fabrication process, performance was strongly improved for the 2~(nd) Gen FPA to meet customer demands for low-cost thermal imaging and thermal sensitivity of 270 mK @ f/1.0 and 9 Hz frame rate was achieved. In addition development of the 3~(rd) Gen FPA with QVGA format, 28 μm pixel pitch and 100 mK thermal sensitivity is ongoing.