Thermal management design from chip to package for high power InGaN/sapphire LEDs applications

摘要

The optical and thermal properties of blue InGaN/sapphire LEDs with a novel structure design for heat dissipation is investigated. The LED chip is designed to directly contact with a cup-shaped Cu heat spreader, and then mounted on a heat sink coated with a diamond-like film. The packaged LED chip with the novel heat dissipation design demonstrates superior light output power and reduced junction temperature as compared with the same LED chip packaged using conventional process.