首页> 外文会议>Annual Conference of Metallurgists >(595646) ARSENIC CODEPOSITION DURING THE INITIAL PHASES OF NUCLEATION AND GROWTH ON STAINLESS STEEL IN NORMAL COPPER ELECTROWINNING CONDITIONS
【24h】

(595646) ARSENIC CODEPOSITION DURING THE INITIAL PHASES OF NUCLEATION AND GROWTH ON STAINLESS STEEL IN NORMAL COPPER ELECTROWINNING CONDITIONS

机译:(595646)在普通铜电解条件下不锈钢末期初始阶段的初始相阶段砷负极沉积

获取原文

摘要

Arsenic (As), bismuth (Bi) and antimony (Sb) are known to affect the quality of copper deposits in copper electrowinning operations. The codeposition of As was previously believed to occur only at current densities far exceeding the range of typical current densities for copper electrowinning. In this study, we investigate the copper electrodeposition on different pretreated stainless steel (SS) substrates from bleed electrolyte in galvanostatic mode at -45 mA/cm?. Scanning electron microscopy (SEM) micrographs illustrate that during the initial phases of copper nucleation and growth, the current density was locally increased due to the pretreatments. It was reasoned that the codepostion of As could possibly occur in normal electrowinning conditions, but the risk can be substantially reduced by good SS substrate handling and maintenance practices.
机译:已知砷(AS),铋(BI)和锑(SB)会影响铜电解过程中铜沉积物的质量。如前所述,如前所述,仅在电流密度范围内仅发生铜电荷铜电流的典型电流密度范围。在这项研究中,我们研究了在-45mA / cm的电压静态模式中从漏血电解质的不同预处理的不锈钢(SS)衬底上的铜电沉积。扫描电子显微镜(SEM)显微照片说明,在铜成核和生长的初始相位期间,由于预处理,电流密度局部增加。有人推出了可以在正常的电瓦宁条件下发生的代号,但是通过良好的SS衬底处理和维护实践可以大大降低风险。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号