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An Enhanced 2D Modelling Technique for Single-Sided Bonded Patches

机译:一种增强的单面粘合贴片2D建模技术

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This paper reviews the most important modelling techniques in the literature and proposes a new to study bonded patch repaired plates by including all known effects on the 1 fatigue crack growth rate. The modelling technique makes use of 2D plate finite elements and takes into account of adhesive failure as well as secondary bending due to the unsym-metrical configuration of single-sided patched plates. Comparisons between 3D models and 2D models were carried out to validate the 2D bending analysis and the calculated stress intensity factors. This new modelling technique was implemented in a computer code interfacing with the commercial FE package MSC NASTRAN and validated by published experimental tests for three different aluminium plates. Good agreements were obtained. The code was then used to conduct a parametric study on the geometry of the patch for two different substrate thicknesses showing that for a thinner substrate the life can be improved with a smaller patch. A tool to compute the most effective patch dimension for a prescribed fatigue life target has been developed.
机译:本文审查了文献中最重要的建模技术,并提出了一种新的学习粘合补丁修复平板,包括所有关于1疲劳裂纹生长速率的所有已知的效果。建模技术利用2D板有限元,考虑到粘合剂故障以及由于单侧贴片板的非对齐配置而引起的辅助弯曲。进行了3D模型和2D模型之间的比较,以验证2D弯曲分析和计算的应力强度因子。这种新的建模技术在与商业FE包MSC Nastran的计算机代码中实现,并通过公布的三个不同铝板的实验测试验证。获得了良好的协议。然后使用该代码对两个不同的基板厚度的贴片的几何形状进行参数研究,示出用于较薄的基板,可以用较小的贴片改善寿命。已经开发了一种计算规定的疲劳寿命目标的最有效补丁维度的工具。

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