COUPLED FDTD-FVM SIMULATION OF MICROWAVE HEATING OF POLYMER MATERIALS FOR MICRO-SYSTEMS PACKAGING APPLICATIONS

摘要

Heating of an idealised polymer load in a novel open-ended variable frequency microwave oven is numerically simulated using a coupled solver approach. The frequency-agile microwave oven bonding system (FAMOBS) is developed to meet rapid polymer curing requirements in microelectronics and optoelectronics manufacturing. The heating of an idealised polymer load has been investigated through numerical modelling. Assessment of the system comprises of simulation of electromagnetic fields and of temperature distribution within the load. Initial simulation results are presented and contrasted with experimental analysis of field distribution.