THE LOSS OF ADHESION OF AU NANOPARTICLES TO THE SILICON WAFER SURFACE DURING N,N-DIMETHYL FORMAMIDE (DMF) EVAPORATION: UNDERSTANDING THE PROCESSES INVOLVED

摘要

Using AFM and XPS analyses, we have demonstrated that slow DMF droplet drying can cause Au nanoparticles to lose adhesion to the Si surface, followed by nanoparticle coalescence and the formation of a 1 nm shell due to the decomposition of the DMF. These initial results may offer a path for cleaning Au nanoparticles on Si wafer surfaces.