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CONTACT TAPES ATTACHED TO CIGS MODULES BY ULTRASONIC WELDING

机译:通过超声波焊接连接到CIGS模块的接触胶带

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Al-plated Cu contact tapes were attached to the Mo back contact of 10×10 cm~2, 30×30 cm~2, and 60×120 cm~2 CIGS solar modules by ultrasonic welding of single welding points. The connection occurred between the Al cladding and the Mo or MoSe_x surface ("configuration M") which is exposed by removing the overlying ZnO/CIGS layer on top of it by mechanical scraping. The average peel strength of the welding points ranges between 1 and 7 N, depending on the welding force, power and energy. For increasing welding forces, the peel strength is controlled successively by the adhesion of the interfaces Al/Mo, Al/Cu and Mo/glass. The contact resistance of about 75 mΩ per welding point, corresponding to a resistivity of 1.8 mΩcm~2, was quite stable in the damp-heat (DH) and thermal-cycling (TC) tests. The corrosion sensitivity of the selenised Mo layer, with its MoSe_x surface, was significantly reduced compared to pure Mo. The efficiencies of the ultrasonically welded and encapsulated CIGS modules remained very stable during the DH and TC tests, showing no negative effects which could be attributed to the welding procedure. The number and characteristics of glass outbreaks were evaluated among several thousand welding points. The defect rate could be reduced to about 0.2% by employing an appropriate fixation of the modules and a sufficiently moderate welding force and energy. Glass outbreaks occurred mainly when the welding points were located at small cracks, holes, or cavities at the Mo/glass surface.
机译:镀Al的Cu接触带贴到的10×10 cm〜2的Mo背接触,30×30 cm〜2的,并且通过单个焊接点的超声焊接60×120 cm〜2个的CIGS太阳能电池组件。所述Al覆层和其是通过机械刮擦除去在其顶部上覆的ZnO / CIGS层露出的Mo或MoSe_x表面(“配置M”)之间发生的连接。 1和7 N之间的焊接点范围的平均剥离强度,这取决于焊接力,功率和能量。为了提高焊接的力,剥离强度是由接口铝/钼,铝/ Cu和Mo /玻璃的粘附依次控制。约75毫欧的每焊接点,这对应于1.8mΩcm〜2的电阻率的接触电阻,是在湿热(DH)相当稳定和热循环(TC)试验。所述selenised Mo层的腐蚀灵敏度,以其MoSe_x表面时,显著相比纯Mo的减小超声波焊接和封装CIGS模块的效率保持在DH和TC测试非常稳定的,表现出这可能是由于没有负面影响到焊接过程。数量和玻璃爆发的特性中,几千个焊接点进行了评价。缺陷率可以通过采用模块的适当的固定和足够温和焊接力和能量可以减少到大约0.2%。玻璃暴发主要发生在焊接点位于在小的裂纹,孔洞,或在沫/玻璃表面的空腔。

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