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Carbon impurity behavior on plasma facing surface of tungsten

机译:钨血浆表面上的碳杂质行为

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In order to study the behavior of carbon ions implanted together with hydrogen ions into tungsten, 1 keV H_3~+ (main component) with 0.1-0.8% of carbon ions were irradiated to pure sintered tungsten and depth profiles of carbon at the tungsten surface were measured. Carbon depth distributions at less than about 1000K were much broader than the carbon ion range distributions, which could be attributed mainly to recoil implantation. Most of injected carbon atoms formed WC (not W_2C) for both C ~0.1% and ~0.8% cases, which is different from the chemical states of carbon atoms thermally diffused into the bulk tungsten (W_2C). Enhanced sputtering of carbon atoms at the tungsten surface was observed at 913 K, which might be owing to a low chemical sputtering yield for carbon.
机译:为了研究将碳离子与氢离子一起植入的碳离子进入钨,1keV H_3〜+(主要成分),含有0.1-0.8%的碳离子的碳离子,并在钨表面碳的碳的深度曲线呈照射到纯烧结测量。小于约1000K的碳深度分布比碳离子范围分布的较宽远远大得多,这可能主要归因于反冲植入。大多数注射的碳原子为C〜0.1%和〜0.8%的WC(不是W_2C),其与碳原子的化学品状态不同,碳原子中的热扩散到散装钨(W_2C)中。在913K的情况下观察到碳原子在钨表面的增强溅射,这可能由于碳的低化学溅射产率。

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