The tendency for ceramic materials with high thermal expansion anisotropy to crack at domain boundaries during thermal cycling has been extensively documented. However, much work still remains to develop a model that can predict this behavior as a function of thermal history. Here we present the development of a statistical model that accurately predicts the temperature history-dependent microcrack formation during thermal cycling of a porous ceramic. The functional form describing this mechanism was developed from a detailed study of a microscale finite element model, which is also discussed. Excellent agreement between experimental results and model predictions is shown.
展开▼
