The Study of Surface Microstructure of PPS Using as Antireflection Coating of Multi-crystalline Silicon Solar Cell

摘要

This paper describes the formation of PS n~+ / p / p~+ / Al structure on the PS / p polysilicon wafers. Saw damage etching and isotropic texturing combined in one processing step. The diffusion emitter junction was homogeneous emitter. The front surface metal grid and back metal contact were carried out by screen-printed metallization. The processing bottlenecks are how to form optimal surface morphology. These require that the depth and sizes of textured pores in PS must meet with the conditions of optimal contact between the interfaces. At the same time the PS coating also doesn't reduce its utility of antireflection. The most promising one is macro-porous layer production. We control the etching conditions and obtained the efficiencies by up to 8% in the condition of no additional bulk passivation processes, no PECVD SiN, ARC layer and no selective diffusion emitter.