Packaging in the IT environment: competing challenges in the design of packaging for electronic products

机译：包装在IT环境中：电子产品包装设计中的竞争挑战

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摘要

Provide an overview of packaging design considerations through modeling and testing to optimize packaging for electronic products and to provide details of the packaging challenge from an environmental perspective.

机译：通过建模和测试概述包装设计考虑因素，以优化电子产品的包装，并提供从环境视角提供包装挑战的细节。

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《IEEE International Symposium on Electronics and the Environment》|2005年||共3页
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Horbal J.; Schaffer M.;
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原文格式 PDF
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中图分类 TN-53;
关键词
electronic products; electronics packaging; environmental factors; IT environment; electronic products packaging; packaging design;

机译：电子产品;电子包装;环境因素;IT环境;电子产品包装;包装设计;

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4. Packaging in the IT environment: competing challenges in the design of packaging for electronic products [C] . Horbal J., Schaffer M. Electronics and the Environment, 2005. Proceedings of the 2005 IEEE International Symposium on . 2005

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5. Simulation Based Design Optimization for Microelectronics Packaging Product. [D] . Xue, Ke. 2010

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Packaging in the IT environment: competing challenges in the design of packaging for electronic products

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