Circuitry analyses by using high quality image acquisition and multi-layer image merge technique

摘要

By using high quality image acquisition and multi-layer image merge technique, a technique of IC circuitry analysis has been developed and successfully applied to more than 50 industrial products analysis in one year. A series of in-house designed software ensures the successful rate to be up to 95% and the total working time to be less than 2 months for analog/mix-signal ICs of any scale and typically 10 /spl sim/100K gates counts digital devices. The software environment was also featured by multiple language, multiple users accessible, project teamwork feasible, TCL script extension support, automatic backup/restore, and GUI based in Windows, Linux, and UNIX platform.