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Understanding and Exploiting T_g Reduction for Surface and Bulk Modification of Polymers with CO_2

机译:理解和利用CO_2的聚合物表面和散装改性的T_G减少

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In addition to the well-known reduction of bulk T_g by CO_2, we have investigated the existence of a reduced T_g for the surface layer of a polymer, and evaluated the effects of CO_2 on this transition and the corresponding layer thickness. The ability to control the depth of the rubbery layer of a polymer affords even greater control over the impregnation process. We will present our current understanding of the fundamental basis for this behavior and a theoretical analysis centered on a description of the entropy density of the surface layer. Subsequently this phenomenon will be the framework for discussing several derivative applications including: modification of biomedical implants for controlled release of therapeutics, bulk extrusion of thermally labile drug compounds with pharmaceutical polymers, and bonding of polymer devices with nanoscale features.
机译:除了通过CO_2众所周知的散装T_G的减少之外,我们研究了聚合物表面层的降低T_G的存在,并评估了CO_2对该转变的影响和相应的层厚度。控制聚合物的橡胶层深度的能力提供了更大的控制浸渍过程。我们将在目前对这种行为的基础基础的理解,以及以表面层的熵密度的描述为中心的理论分析。随后这种现象将是讨论几种衍生应用的框架,包括:用于控制治疗剂的生物医学植入物的修饰,具有药物聚合物的热不稳定药物化合物的体积挤出,以及具有纳米级特征的聚合物装置的粘合。

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