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An efficient algorithm for 3-D interconnect capacitance extraction considering the floating dummy-fills

机译:考虑浮动虚拟填充的3-D互连电容提取有效算法

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The insertion of dummy metals is necessary to reduce the pattern-dependent variations of the dielectric thickness in the CMP process. This makes conventional tools of capacitance extraction exhibit prohibitive calculation time. This paper presents an efficient method for 3D capacitance extraction with taking the floating dummies into account. Based on the QMM-accelerated BEM, our method inherits high computational speed while considering the floating conditions and using a new preconditioner. For some typical structures including floating dummies, our method shows high accuracy and over 1000x speed-up over Raphael, about 10x speed-up over the method in the work of J.-K. Park et al. (2000).
机译:伪金属的插入是必要的,以减少CMP过程中介电厚度的图案依赖性变化。这使得传统的电容提取工具表现出令人满意的计算时间。本文介绍了一种有效的3D电容提取方法,以考虑浮动假人。基于QMM加速BEM,我们的方法在考虑浮动条件并使用新的预处理器时继承高计算速度。对于一些典型的结构,包括浮动虚拟机,我们的方法在Raphael上显示了高精度和超过1000倍的加速,大约在J.K的工作中加速了10倍。 Park等人。 (2000)。

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