A New Version Transfer Mold-Type IPMs with Compact Package

机译：具有紧凑型包装的新型版本转移模具IPM

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This paper presents a new version Dual In-line Package Intelligent Power Module (DIP-IPM Ver.4) developed by Mitsubishi Electric for home appliance motor control. In DIP-IPM Ver.4, Pb-free has been realized completely both for chip bonding solder and lead plating solder in consideration of environmental protection. Package miniaturization has been achieved by new package concept using insulating resin sheet with high thermal conductivity, direct wire bonding technology, etc.

机译：本文介绍了由Mitsubishi Electric进行家电电机控制开发的新版本的双线式封装智能电源模块（DIP-IPM Ver.4）。在DIP-IPM Ver.4中，考虑到环境保护，可以完全实现PB的芯片粘接焊料和铅电镀焊料。通过具有高导热系数，直线键合技术等的新型包装概念来实现包装小型化。

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来源
《International PCIM China Conference on Power Electronics》|2005年||共6页
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Shinya Shirakawa; Toru Iwagami; Hisashi Kawafuji; Mamoru Seo; Katsumi Satou;
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中图分类独立电源技术（直接发电）;
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机译：新型紧凑型转移模具式IPM
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A New Version Transfer Mold-Type IPMs with Compact Package

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