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Source polarization and OPC effects on illumination optimization

机译:源极化和OPC对照明优化的影响

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To perform a thorough source optimization during process development is becoming more critical as we move to leading edge-technology nodes. With each new node the acceptable process margin continues to shrink as a result of lowering k1 factors. This drives the need for thorough source optimization prior to locking down a process in order to attain the maximum common depth of focus (DOF) the process will allow. Optical proximity correction (OPC) has become a process-enabling tool in lithography by providing a common process window for structures that would otherwise not have overlapping windows. But what effect does this have on the source optimization? With the introduction of immersion lithography there is yet another parameter, namely source polarization, that may need to be included in an illumination optimization process. This paper explored the effect polarization and OPC have on illumination optimization. The Calibre ILO (Illumination Optimization) tool was used to perform the illumination optimization and provided plots of DOF vs. various parametric illumination settings. This was used to screen the various illumination settings for the one with optimum process margins. The resulting illumination conditions were then implemented and analyzed at a full chip level. Based on these results, a conclusion was made on the impact source polarization and OPC would have on the illumination optimization process.
机译:为了在流程开发期间进行彻底的源优化,正如我们转向前导技术节点的那样越来越重要。由于每个新节点,可接受的过程边缘继续由于降低K1因素而缩小。这驱动了在锁定过程之前对彻底源优化的需求,以便获得最大常见的焦点(DOF)该过程将允许。光学邻近校正(OPC)通过为否则没有重叠窗口的结构提供公共过程窗口,它已成为光刻中的过程启用工具。但这对源优化有何影响?随着浸入光刻的引入,还有另一个参数,即源极化,可能需要包括在照明优化过程中。本文探讨了效果极化和OPC对照明优化。用于对各种参数照明设置的DOF与各种参数照明设置的照明优化和提供的曲线图进行了途径ILO(照明优化)工具。这用于筛选具有最佳过程边缘的各种照明设置。然后在全芯片水平下实施并分析得到的照明条件。基于这些结果,对撞击源极化进行了结论,OPC对照明优化过程进行了结论。

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