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Selecting Tantalum Capacitors for Low Profile, Small Form Factor Applications

机译:选择钽电容器,用于低档,小型系子应用

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Efforts continue in reducing the size of power systems, while at the same time improving overall system performance. This is especially important for applications with low profile, small form factor embedded controllers. Board space is at a premium for these new embedded controller applications. Capacitors, electrolytic, or ceramic MLCCs usually occupy a large amount of valuable PC board space in and around the power systems and the processor. Designers need to pay careful attention in the selection of the right capacitor for use in these space-sensitive applications. The challenge for component suppliers is to develop innovative miniaturized, smaller footprint, component solutions that not only solve the space problem, but also help to improve the overall power system efficiency. The capacitors discussed are of multi-anode construction with lower equivalent series resistance (ESR) as compared to conventional packaging. For capacitor suppliers, the drive toward miniaturization requires careful analysis of the power system's electrical requirements, as well as mechanical concerns and overall manufacturability. This paper will discuss the selection and application of capacitors for low profile, small form factor applications.
机译:努力继续降低电力系统的大小,同时提高整体系统性能。这对于具有较低轮廓,小型嵌入式控制器的应用尤其重要。这些新的嵌入式控制器应用程序的电路板空间为溢价。电容器,电解或陶瓷MLCC通常占据电力系统和处理器周围的大量有价值的PC板空间。设计师需要在选择右电容器中仔细注意,以用于这些空间敏感的应用。组件供应商的挑战是开发创新的小型化,较小的足迹,不仅解决空间问题的组件解决方案,而且有助于提高整体电力系统效率。与传统包装相比,讨论的电容器具有较低的等效串联电阻(ESR)的多阳极结构。对于电容器供应商来说,对小型化的驱动需要仔细分析电力系统的电气需求,以及机械问题和整体可制造性。本文将讨论低轮廓,小型系数应用的电容器的选择和应用。

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