Microsystems and mechanics

摘要

Study, design and industrial production of microsystems implies complex processes in which many disciplines like physics, chemistry, material science, electronics and mechanics play a central role. This paper contains an overview of important mechanical aspects in design and reliability of microsystems. Starting from the past nine years experience of the research group with reference to real devices, some key mechanical issues are discussed which concern dissipative phenomena inducing damping in vibrating devices, mechanical characterization of materials at the scale of micron, consequences of impacts due to accidental drop and spontaneous adhesion or stiction phenomena.