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Low Impact Resist Metrology: The use of ultra low voltage for high accuracy performance

机译:低抗冲击计量:使用超低电压进行高精度性能

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Previous results have demonstrated that the most significant line slimming occurs during the initial measurement and is a strong function of landing energy. Since it is difficult to accurately estimate the initial CD value (M0), many test protocols rely on the measurement change between the first and second measurement pass (M1-M2), to evaluate line slimming. However, since the slimming behavior of ArF resist systems has been shown to be exponential and dependant upon the resist formulation, using M1-M2 as the metric for comparing between CD SEM suppliers can severely underestimate the impact of a particular system setup on line slimming. The experiments reported here represent an attempt to assess the impact of the initial measurement (M0-M1) on line slimming. A series of experiments were designed to assess the impact of landing energy on line slimming for ArF photoresist. To validate the results of the experiments, an etched poly wafer was used as a control sample to ensure that metrology differences noted on the ArF resist between a high voltage 800 eV and an Ultra-Low Voltage (ULV) 100 eV condition arose purely from the interaction of the E-beam with the resist. The most significant line slimming was observed to occur during the first measurement at 800 eV, with greater than 10 nm of slimming observed on a nominal 120nm lines), followed by relatively stable slimming performance thereafter. The 100 eV condition demonstrated a significantly reduced level of slimming as a result of the first measurement; if there was any slimming, it could not be distinguished from the uncertainty in the estimate of the initial CD (M0). Measurements were also performed dynamically and at the ULV 100 eV condition slimming was indistinguishable from contamination induced linewidth growth, leading to an initial value closely matching the unperturbed linewidth (M0). The superior ArF line slimming performance at ULV is consistent with numerous published results, and demonstrates the need to assess slimming by a meaningful metric through a comparison of the initial measurement (M1) at high and low voltages, or by a comparison of the initial measurement M1 with the unperturbed linewidth (M0). The results of the experiments conducted point to a need for Low Impact Resist Measurement performance, which is fulfilled by Ultra-Low Voltage Metrology
机译:以前的结果已经证实,在初始测量过程中发生的最显著线纤体是着陆能量的强函数。由于难以准确地估计初始CD值(M0),许多测试协议依赖于所述第一和第二测量路径(M1-M2)之间的测量的变化,来评价线减肥。然而,由于ARF的减肥行为抗蚀剂系统已被证明是指数的和依赖于抗蚀剂制剂,采用M1-M2作为度量CD SEM供应商可以严重低估上线纤体一个特定的系统设置的影响之间进行比较。这里报导的实验代表试图评估线纤体初始测量(M0-M1)的影响。一系列的实验旨在评估着陆能量的上线为减肥ArF光致抗蚀的影响。为了验证实验的结果,晶片被用作对照样品,以确保在使用ArF指出,计量的差异被蚀刻的多晶硅的高电压800 eV和一个超低压(ULV)100eV的条件之间的抗蚀剂从单纯的产生电子束抗蚀剂的相互作用。被观察到的最显著线纤体在800电子伏特的第一测量过程中发生,具有大于在标称为120nm系中观察到减肥)为10nm,接着相对稳定的性能纤体其后。在100eV的状态显示减肥作为第一测定的结果的一个显著降低水平;如果有任何瘦身,它不能从最初的CD(M0)的估计的不确定性区分。测量也动态地执行,并在ULV 100eV的条件纤体是从污染引起的线宽生长没有区别,导致紧密匹配未受扰动的线宽(M0)的初始值。在ULV优越的ArF线纤体性能与众多的公布的结果一致,并表明,有必要通过一个有意义的度量通过初始测量(M1)中的高电压和低电压的比较来评估纤体,或由初始测量的比较M1与泰然自若线宽(M0)。进行点需要低影响的实验结果抵制测量性能,这是超低压计量完成

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