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Applications Of Sims Supporting Front- And Back-End Process Characterization To Achieve Electrically Matched Devices

机译:SIMS支持前端和后端流程表征的SIMS应用达到电匹配的设备

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Application of SIMS metrology in high volume wafer manufacturing allows comparison of important physical characteristics of devices and can address changes in the process during early stages of process flow, thus improving production cycle. In the current paper, we investigate the correlation between wafer-level SIMS characterization and electrical characteristics of devices in a wide spectrum of front and back-end applications:·High precision SIMS analysis for implanter recipe development and monitoring is a technique that has provided major contributions to achieve electrically matched devices. SIMS analysis is also used widely on gate material selection and characterization. As SiGe/SiGeC is taking precedence over III-V materials for RF applications due to processing simplicity, SIMS analytical technique provides major metrology support on process targeting and development. ·Fluorine SIMS analysis investigation in TiN, W and its relation with increased via resistance and voids on the nucleation is an example of SIMS analysis application for back-end process support.
机译:SIMS Metrologology在大容量晶片制造中的应用允许比较器件的重要物理特性,并且可以在工艺流程的早期阶段进行处理的变化,从而改善生产周期。在目前的论文中,我们研究了在广泛的前端和后端应用中晶圆级SIMS表征和设备的电气特性的相关性:·植入机配方开发和监测的高精度SIMS分析是一种提供专业的技术贡献实现电匹配设备。 SIMS分析也广泛用于栅极材料选择和表征。由于SiGe / SIGEC采取优先于III-V材料,由于加工简单,SIMS分析技术提供了对过程定位和开发的主要计量支持。 ·锡,W的氟SIMS分析调查与核切割上的电阻和空隙增加的关系是用于后端过程支持的SIMS分析应用的示例。

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